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Patent Searching and Data


Title:
CARRIER SUBSTRATE ASSEMBLY, AND FABRICATION METHOD OF FLEXIBLE DISPLAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/124700
Kind Code:
A1
Abstract:
A carrier substrate assembly, and a method of using the carrier substrate assembly, for fabricating a flexible display substrate. The carrier substrate assembly comprises a carrier substrate(10), which has a central region(102) with a plurality of through-holes(11) and a peripheral region(101) surrounding the central region(102). The plurality of through-holes(10) are configured to provide passageways for a reaction solution to facilitate separation of the flexible thin film(30) laminated over an upper surface(10a) of the carrier substrate(10) from the carrier substrate(10) during the lifting-off of the flexible thin film(30).

Inventors:
CHEN WEITAO (CN)
WANG JUNWEI (CN)
SONG YANG (CN)
Application Number:
PCT/CN2016/088167
Publication Date:
July 27, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE DISPLAY TECH CO (CN)
International Classes:
B32B38/10; B32B37/12
Foreign References:
CN104317074A2015-01-28
CN104992944A2015-10-21
CN104658990A2015-05-27
CN104409408A2015-03-11
CN104570326A2015-04-29
CN104880846A2015-09-02
CN105690974A2016-06-22
US20130288454A12013-10-31
US20150096673A12015-04-09
Other References:
See also references of EP 3405345A4
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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