Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CATION-CONTAINING POLISHING COMPOSITION FOR ELIMINATING PROTRUSIONS AT PERIPHERY OF LASER MARK
Document Type and Number:
WIPO Patent Application WO/2021/065815
Kind Code:
A1
Abstract:
[Problem] To provide a polishing composition for eliminating protrusions at a periphery of a laser mark in a wafer polishing step; a method for producing the polishing composition; and a polishing method that uses the polishing composition. [Solution] A polishing composition which contains silica particles and water and which is characterized in that the polishing composition further contains a tetraalkylammonium ion at a mass ratio of 0.400-1.500:1 relative to SiO2 in the silica particles and SiO2 dissolved in the polishing composition is contained at a mass ratio of 0.100-1.500:1 relative to SiO2 in the silica particles. The tetraalkylammonium ion is derived from a compound selected from the group consisting of alkali silicates, hydroxides, carbonates, sulfates and halides, and is contained at a ratio of 0.2-8.0 mass% in the polishing composition. The dissolved SiO2 is derived from a tetraalkylammonium silicate, calcium silicate, sodium silicate or a mixture of these.

Inventors:
YAMAGUCHI HAYATO (JP)
ISHIJIMA HIBIKI (JP)
ISHIMIZU EIICHIRO (JP)
Application Number:
PCT/JP2020/036667
Publication Date:
April 08, 2021
Filing Date:
September 28, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
WO2019065357A12019-04-04
WO2015019706A12015-02-12
WO2017110315A12017-06-29
Foreign References:
JP2018019075A2018-02-01
JPH09306880A1997-11-28
JP2009516928A2009-04-23
JP2015233031A2015-12-24
JP2017183359A2017-10-05
Other References:
See also references of EP 3916061A4
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
Download PDF: