Title:
CENTERLESS GRINDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2001/091967
Kind Code:
A1
Abstract:
A centerless grinding machine (1) comprising a bed (108), a grinding wheel head (101), an adjusting grinding wheel head (102), and a work rest (103), wherein the grinding wheel head (101) and the adjusting grinding wheel head (102) are moved toward and away from each other by their respective feeding devices (10, 10). Each feeder (10, 10) is provided with a feed screw (11, 11) fixed at one end thereof to the work rest (103), with a nut (12, 12) screwed on the feed screw (11, 11) being so held by the grinding wheel head (101) and the adjusting grinding wheel head (102) that its axial movement is controlled but that it is allowed to rotate. And, the nuts (12, 12) are rotated by driving motors (15, 15). According to this centerless grinding machine (1), since the feed screws (11, 11) are fixed to the work rest (103), even if the bed (108) is thermally deformed by the heat of grinding, the resulting loss of processing accuracy can be kept to a minimum.
Inventors:
IKEDA JUNZO (JP)
Application Number:
PCT/JP2001/004341
Publication Date:
December 06, 2001
Filing Date:
May 23, 2001
Export Citation:
Assignee:
KOYO MACHINE IND CO LTD (JP)
IKEDA JUNZO (JP)
IKEDA JUNZO (JP)
International Classes:
B23Q1/01; B23Q11/00; B24B5/18; B24B41/00; (IPC1-7): B24B5/18
Foreign References:
| US5558567A | 1996-09-24 | |||
| JPH0852631A | 1996-02-27 | |||
| JPH0166953U | 1989-04-28 | |||
| JPH0911097A | 1997-01-14 | |||
| JPH10328984A | 1998-12-15 |
Attorney, Agent or Firm:
Murakami, Satoshi (Takeda Bldg. 1-2 Minamikyuhojimachi 2-chom, Chuo-ku Osaka-shi Osaka, JP)
Download PDF:
Previous Patent: METHOD AND APPARATUS FOR USE IN APPLYING HEATING
Next Patent: METHOD AND APPARATUS FOR MULTIPLE CHAMFERING OF A WAFER
Next Patent: METHOD AND APPARATUS FOR MULTIPLE CHAMFERING OF A WAFER