CERAMIC BOARD AND METHOD FOR MAKING SAME

WIPO Patent Application WO/2022/163040

A1

A first ceramic part (110) has: in an in-plane direction, a first side (L1); a second side (L2) that is opposite to the first side (L1); and a third side (L3) that has a first end (E1) connecting to the first side (L1) and a second end (E2) connecting to the second side (L2). A second ceramic part (121) on the first ceramic part (110) has: in the in-plane direction, a fourth side (L4) overlying the first side (L1) of the first ceramic part (110); a fifth side (L5) overlying the second side (L2) of the first ceramic part (110); and a sixth side (L6) connecting to the fourth side (L4) and to the fifth side (L5). In the in-plane direction, the sixth side (L6) of the second ceramic part (121) has a protruding portion (PT) that protrudes from the third side (L3) of the first ceramic part (110). The protruding portion (PT) of the second ceramic part (121) is apart from the first end (E1) of the first ceramic part (110).

WO/2022/172767	CIRCUIT BOARD AND MANUFACTURING METHOD
JPH04239157	SEMICONDUCTOR DEVICE
JPH05275565	MANUFACTURE OF THIN FILM CIRCUIT BOARD

MIHARA YOSHIKAZU (JP)
IKEDA TAKUJI (JP)

PCT/JP2021/038911

August 04, 2022

October 21, 2021

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NGK ELECTRONICS DEVICES INC (JP)
NGK INSULATORS LTD (JP)

H01L23/13; B28B11/00; B28B11/14; H01L23/12; H01L23/373; H05K1/02; H05K3/00

JPH0741477U	1995-07-21
JP2013143506A	2013-07-22
JP2003273526A	2003-09-26
JP2016195244A	2016-11-17
JPS495653U	1974-01-18
JPS6355567U	1988-04-14
JP2014153587A	2014-08-25
JP2020096124A	2020-06-18

YOSHITAKE Hidetoshi et al. (JP)

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