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Patent Searching and Data


Title:
CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/065407
Kind Code:
A1
Abstract:
The present invention relates to a ceramic circuit board and a manufacturing method therefor, the ceramic circuit board comprising: a ceramic substrate; a base metal layer formed on the ceramic substrate and including NiCr; and a conductive layer formed on the base metal layer, wherein a weight ratio of Ni:Cr of the base metal layer is 90:10 to 75:25. When the ceramic circuit board of the present invention is used, adhesion strength is enhanced such that the metal layer is not separated from the ceramic circuit board even when the ceramic circuit board is repetitively used by applying a current thereto for a long time, thereby enabling reliability to be enhanced, and thus an electronic part element having a large caloric value, such as a high-brightness LED, a photovoltaic power generation device, or an electronic part for a hybrid vehicle, can be safely loaded thereon.

Inventors:
PARK MI SO (KR)
KWAK MAN SEOK (KR)
LEE EUN BOK (KR)
KIM DONG LAE (KR)
Application Number:
PCT/KR2016/009704
Publication Date:
April 20, 2017
Filing Date:
August 31, 2016
Export Citation:
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Assignee:
KCC CORP (KR)
International Classes:
H05K1/03; H05K1/09; H05K3/12; H05K3/42
Foreign References:
JP2015030658A2015-02-16
KR101101574B12012-01-02
JP2015062953A2015-04-09
JPH08255973A1996-10-01
JP2012250284A2012-12-20
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
특허법인 태평양 (KR)
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