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Patent Searching and Data


Title:
CERAMIC CIRCUIT BOARD, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD, AND MODULE USING CERAMIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/199060
Kind Code:
A1
Abstract:
[Problem] To provide a ceramic circuit board and a power module with outstanding heat resistance cycle properties. [Solution] Provided is a ceramic circuit board, formed by a ceramic substrate and a copper plate being bonded via a brazing filler material that contains silver, copper, and an active metal, wherein the bonding void ratio is 1.0% or less and the diffusion distance of the silver as a constituent of the brazing filler material is 5–20 µm. Also provided is a method for manufacturing the ceramic circuit board, characterized in that: the heating time in the 400–700°C temperature range during a step in which the temperature is raised to a bonding temperature is 5–30 minutes; and bonding is performed by maintaining a bonding temperature of 720–800°C for 5–30 minutes.

Inventors:
HARADA YUSAKU (JP)
YUASA AKIMASA (JP)
NAKAMURA TAKAHIRO (JP)
MORITA SHUHEI (JP)
NISHIMURA KOUJI (JP)
Application Number:
PCT/JP2018/016540
Publication Date:
November 01, 2018
Filing Date:
April 24, 2018
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/36; H01L23/12; H01L25/07; H01L25/18
Foreign References:
JP2002274964A2002-09-25
JPH11157952A1999-06-15
JP2014187411A2014-10-02
JP2003188310A2003-07-04
Other References:
See also references of EP 3618107A4
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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