Title:
CERAMIC CUTTING METHOD AND EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2021/221378
Kind Code:
A1
Abstract:
The present invention relates to a ceramic cutting method and equipment, which is provided with a configuration comprising: a beam irradiation unit for irradiating a beam of a wavelength that is absorbed by a pattern formed on an upper surface of a ceramic and partially absorbed by the ceramic; a coolant spraying unit for spraying a coolant onto the ceramic irradiated with the beam, wherein part or all of the pattern is removed by heating and cooling the ceramic at the same time, and is cut by reducing thermal damage by using the stress caused by the recrystallization of an upper layer or all of the ceramic or the stress generated by the thermal expansion and contraction of the upper layer or all of the ceramic, thereby recrystallizing the ceramic by heating and cooling the ceramic at the same time, or cutting the ceramic by heating until the ceramic melts, and cooling to apply thermal stress to the inside of the ceramic, followed by an additional separation process of a ceramic material without loss.
Inventors:
LEE JUNG JOON (KR)
RYU JI YUN (KR)
RYU JI YUN (KR)
Application Number:
PCT/KR2021/005025
Publication Date:
November 04, 2021
Filing Date:
April 21, 2021
Export Citation:
Assignee:
ITI CO LTD (KR)
International Classes:
B23K15/08; B23K15/00; B23K26/14; B23K26/38; B23K26/70; B28D1/22
Foreign References:
| KR100881466B1 | 2009-02-06 | |||
| KR20180040361A | 2018-04-20 | |||
| JP2014043363A | 2014-03-13 | |||
| KR20150043794A | 2015-04-23 | |||
| KR101267760B1 | 2013-05-23 | |||
| KR102216298B1 | 2021-02-18 | |||
| KR102216294B1 | 2021-02-18 | |||
| KR101119289B1 | 2012-03-15 | |||
| JP2013112532A | 2013-06-10 |
Other References:
See also references of EP 4144472A4
Attorney, Agent or Firm:
WELL PATENT LAW FIRM (KR)
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