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Patent Searching and Data


Title:
CERAMIC SUBSTRATE, BONDED BODY, MODULE, AND CERAMIC SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/117203
Kind Code:
A1
Abstract:
This ceramic substrate has a ceramic as a main constituent material, and has a first main surface (10A), and a second main surface (10B) that is positioned on the reverse side of the first main surface (10A). In the second main surface (10B), a recessed section (1) recessed to the first main surface (10A) side is formed. A wiring section (5) extending from an outer peripheral surface of the ceramic substrate (10) to the inside of the recessed section (1) is formed, and a bottom section (2) of the recessed section (1), said bottom section being positioned on the first main surface (10A) side, has a thin portion compared with other portions of the ceramic substrate (10), said other portions excluding the bottom section (2).

Inventors:
KONNO NOBUAKI (JP)
HIRATA YOSHIAKI (JP)
Application Number:
JP2015/080742
Publication Date:
July 28, 2016
Filing Date:
October 30, 2015
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/04; B81B7/02; H01L23/02; H01L23/08; H01L23/12; H01L25/00; H05K3/46
Foreign References:
JP2013524540A2013-06-17
JP2010067729A2010-03-25
JP2004055991A2004-02-19
JP2013108876A2013-06-06
Other References:
See also references of EP 3252808A4
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
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