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Patent Searching and Data


Title:
CHEMICAL BONDING METHOD AND JOINED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/045163
Kind Code:
A1
Abstract:
The present invention achieves chemical bonding by means of a joined film made of oxides formed on a joined surface. In a vacuum container, amorphous oxide thin films are respectively formed on smooth surfaces of two substrates, and the two substrates overlap such that the amorphous oxide thin films formed on the two substrates come into contact with each other, thereby causing chemical bonding involving an atomic diffusion at a joined interface between the amorphous oxide thin films to join the two substrates.

Inventors:
SHIMATSU TAKEHITO (JP)
UOMOTO MIYUKI (JP)
MIYAMOTO KAZUO (JP)
MIYAMOTO YOSHIKAZU (JP)
KATOH NOBUHIKO (JP)
MORIWAKI TAKAYUKI (JP)
SAITOH TAKAYUKI (JP)
Application Number:
PCT/JP2020/033471
Publication Date:
March 11, 2021
Filing Date:
September 03, 2020
Export Citation:
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Assignee:
UNIV TOHOKU (JP)
CANON ANELVA CORP (JP)
International Classes:
B23K20/00; H01L21/02
Domestic Patent References:
WO2011027871A12011-03-10
WO2018020780A12018-02-01
Foreign References:
JPS541661B21979-01-27
JP5569964B22014-08-13
JP2015222970A2015-12-10
Other References:
M.P. MASZARAG. GOETZA. CAVIGILAJ. B. MCKITTERICK, J. APPL. PHYS., vol. 64, 1988, pages 4943
Attorney, Agent or Firm:
OGURA & CO. (JP)
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