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Patent Searching and Data


Title:
CHEMICAL MECHANICAL PLANARIZATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/047942
Kind Code:
A1
Abstract:
Disclosed is a chemical mechanical planarization apparatus, comprising a polishing module, a cleaning unit (200) and a wafer transmission module, wherein the polishing module includes two columns of polishing unit arrays (100), and each column of polishing unit arrays (100) includes multiple groups of polishing units (110); loading/unloading stages (116) corresponding to the two columns of polishing unit arrays (100) are longitudinally arranged in the column direction of the polishing unit arrays (100); and work portion wafer transmission units (120) of the wafer transmission module are located vertically above the loading/unloading stages (116), so as to complete transmission of wafers between other loading/unloading areas and the loading/unloading stages (116), and between the loading/unloading stages (116). Since the wafer transmission units (120) are arranged above the loading/unloading stages (116), when polishing heads load or unload wafers at the loading/unloading stages (116), the wafer transmission units (120) can run through the polishing units (110) at any time without being interfered with; and using this layout facilitates reduction of a transmission distance, thereby significantly improving the processing efficiency of the chemical mechanical planarization apparatus compared to that of a similar apparatus.

Inventors:
GU HAIYANG (CN)
ZHANG ZHIJUN (CN)
GU FENG (CN)
WANG DONGHUI (CN)
Application Number:
PCT/CN2018/110052
Publication Date:
March 12, 2020
Filing Date:
October 12, 2018
Export Citation:
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Assignee:
HANGZHOU SIZONE ELECTRONIC TECH CO LTD (CN)
International Classes:
B24B37/04; B24B29/02; H01L21/67; H01L21/677
Foreign References:
CN203282328U2013-11-13
CN108155126A2018-06-12
CN101277787A2008-10-01
US7335092B12008-02-26
CN105870045A2016-08-17
CN107622965A2018-01-23
CN103252705A2013-08-21
Attorney, Agent or Firm:
NANJING ZHISHI LAW FIRM OF INTELLECTUAL PROPERTY (CN)
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