Title:
CHEMICAL MECHANICAL PLANARIZATION CONTROL METHOD AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/166777
Kind Code:
A1
Abstract:
A chemical mechanical planarization control method, comprising: planarizing a wafer (w) by using a carrier head (30) having a plurality of pressure chambers (C1, C2, C3, C4, C5), wherein the pressure chambers correspondingly divide the surface of the wafer into a plurality of zones (Zone1, Zone2, Zone3), and providing a plurality of collection points for the zones, so as to measure the surface topography of the wafer; performing weighted processing on measurement values of the collection points in the zones, and calculating actually measured surface morphology of the wafer according to the measurement values which have been subjected to the weighted processing; and comparing the difference between the actually measured surface morphology of the wafer with target surface morphology, and adjusting planarization parameters corresponding to the pressure chambers, so as to control the surface morphology of each zone of the wafer. Further disclosed are a chemical mechanical planarization control system, a control device and a computer-readable storage medium. By means of the chemical mechanical planarization control method, measurement values of collection points in each zone are subjected to weighted processing, so as to accurately reflect the deviation of each zone, thereby improving the accuracy of an intelligent process control algorithm.
Inventors:
ZHAO DEWEN (CN)
NI MENGQI (CN)
NI MENGQI (CN)
Application Number:
PCT/CN2022/074446
Publication Date:
August 11, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
HWATSING TECH CO LTD (CN)
International Classes:
B24B37/005; B24B49/10; G05B19/048; H01L21/304
Foreign References:
| CN112936085A | 2021-06-11 | |||
| US20140242878A1 | 2014-08-28 | |||
| CN111246970A | 2020-06-05 | |||
| CN111496665A | 2020-08-07 | |||
| CN104924198A | 2015-09-23 |
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