Title:
CHEMICAL-MECHANICAL POLISHING COMPOSITION, RINSE COMPOSITION, CHEMICAL-MECHANICAL POLISHING METHOD, AND RINSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255862
Kind Code:
A1
Abstract:
Provided are: a chemical-mechanical polishing composition containing an aqueous carrier and at least one compound selected from the group consisting of an abrasive, a basic component, a quaternary polyammonium salt, a quaternary ammonium salt having 6 or more carbon atoms, and an alkylated polymer having an amide structure; a rinse composition containing said at least one compound and an aqueous carrier; and a chemical-mechanical polishing method and a rinsing method which are for a substrate and use the compositions.
Inventors:
KITAMURA HIROSHI (JP)
MASUDA TSUYOSHI (JP)
MATSUMURA YOSHIYUKI (JP)
NAMIKI AKIHISA (JP)
SAITO TAKESHI (JP)
MASUDA TSUYOSHI (JP)
MATSUMURA YOSHIYUKI (JP)
NAMIKI AKIHISA (JP)
SAITO TAKESHI (JP)
Application Number:
PCT/JP2020/023089
Publication Date:
December 24, 2020
Filing Date:
June 11, 2020
Export Citation:
Assignee:
NIHON CABOT MICROELECTRONICS K K (JP)
International Classes:
B24B55/06; B24B37/00; C09G1/02; C09K3/14; H01L21/304
Domestic Patent References:
| WO2009119178A1 | 2009-10-01 | |||
| WO2015019706A1 | 2015-02-12 |
Foreign References:
| JP2011086713A | 2011-04-28 | |||
| JP2015188093A | 2015-10-29 | |||
| JP2009088243A | 2009-04-23 | |||
| JP2008244450A | 2008-10-09 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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