Title:
CHEMICAL POLISHING SOLUTION USED FOR SURFACE TREATMENT OF COPPER OR COPPER ALLOYS, AND SURFACE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2021/251204
Kind Code:
A1
Abstract:
The present invention pertains to a treatment solution for appropriately removing natural oxide films or organic substances present on the surface of copper or copper alloys. The present invention provides a chemical polishing solution used for surface treatment of copper or copper alloys, the chemical polishing solution containing, on the basis of the total amount of the chemical polishing solution, (A) 0.1-3.5 mass% of hydrogen peroxide, (B) 1-20 mass% of at least one selected from the group consisting of sulfuric acid and nitric acid, (C) 0.05-0.8 mass% of a fluoride in terms of fluorine atoms, (D) 0.01-1 mass% of at least one selected from the group consisting of anthranilic acid, cyclohexylamine, cyclohexanol, and 1,5-pentanediol, (E) 0.0005-0.005 mass% of a fluorine-based surfactant, and (F) water.
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Inventors:
KUROSAWA SHINYA (JP)
MATSUNAGA HIROSHI (JP)
TAMAI SATOSHI (JP)
MATSUNAGA HIROSHI (JP)
TAMAI SATOSHI (JP)
Application Number:
PCT/JP2021/020778
Publication Date:
December 16, 2021
Filing Date:
June 01, 2021
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C23G1/10; C23G1/06
Foreign References:
| JPS5286933A | 1977-07-20 | |||
| JPS58197277A | 1983-11-16 | |||
| JP2013245401A | 2013-12-09 | |||
| JP2005220365A | 2005-08-18 | |||
| JP2005133147A | 2005-05-26 | |||
| KR20160116943A | 2016-10-10 | |||
| JP2017031502A | 2017-02-09 | |||
| JP2006511701A | 2006-04-06 | |||
| JPH09184081A | 1997-07-15 |
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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