Title:
CHIP COMPONENT, METHOD FOR MANUFACTURING CHIP COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/019867
Kind Code:
A1
Abstract:
A chip component (1) is provided with: an electronic component (10) including a first electrode (11) and a second electrode (12) disposed at an interval from the first electrode in a first direction (A); a first bonding portion (21) bonded to the first electrode; and a second bonding portion (22) bonded to the second electrode. The material of which the first bonding portion and the second bonding portion are configured includes solder. The first bonding portion includes a first protruding part (21A) protruding against the first electrode in a second direction (B) intersecting the first direction. The second bonding portion includes a second protruding part (22A) protruding against the second electrode in the second direction.
Inventors:
TANABE TSUYOSHI (JP)
KAWAZOE TETSUYA (JP)
OKAMOTO TAKUYA (JP)
SHIBATA YOSHIHIRO (JP)
SASAKI SHUNSUKE (JP)
KAWAZOE TETSUYA (JP)
OKAMOTO TAKUYA (JP)
SHIBATA YOSHIHIRO (JP)
SASAKI SHUNSUKE (JP)
Application Number:
PCT/JP2020/019343
Publication Date:
February 04, 2021
Filing Date:
May 14, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01C1/142; H01C1/148; H01C7/00; H01C17/28; H01G2/06; H01G4/228; H01G4/232; H01G4/30
Domestic Patent References:
| WO2015108151A1 | 2015-07-23 |
Foreign References:
| JP2011040720A | 2011-02-24 | |||
| JP2006221690A | 2006-08-24 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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