Title:
CHIP COMPONENT AND METHOD FOR MANUFACTURING CHIP COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/117345
Kind Code:
A1
Abstract:
A chip component comprising: a substrate having a front surface with a functional element formed thereon, a back surface opposite the front surface, and a side surface enclosing the front surface and the back surface; an electrode formed on the front surface of the substrate; a side surface insulating layer formed in a first portion of the side surface continuous with the front surface of the substrate, the side surface insulating layer exposing a second portion of the side surface on the back surface side of the substrate with respect to the first portion; and a back surface resin layer formed on the back surface of the substrate. In the chip component, the substrate has a rectangular shape in plan view. In plan view, the first portion of the side surface of the substrate has a corner portion formed in a round shape. The second portion of the side surface of the substrate has a corner portion which may be formed in a sharp shape.
Inventors:
ARAKAWA TAKAHIRO (JP)
Application Number:
PCT/JP2020/039343
Publication Date:
June 17, 2021
Filing Date:
October 20, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01F17/00; H01C7/00; H01C17/00; H01G4/30; H01G4/33; H01L21/301; H01L25/00
Domestic Patent References:
| WO2013111497A1 | 2013-08-01 | |||
| WO2011058977A1 | 2011-05-19 |
Foreign References:
| JP2011040480A | 2011-02-24 | |||
| JP2007266421A | 2007-10-11 | |||
| JP2016066777A | 2016-04-28 | |||
| JP2009158589A | 2009-07-16 | |||
| JP2009267032A | 2009-11-12 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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