Title:
CHIP COMPONENT AND CHIP COMPONENT PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/075222
Kind Code:
A1
Abstract:
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional element, formed thereon; a pair of internal electrodes (each composed of a front surface electrode 2, an end surface electrode 6, and a reverse surface electrode 5) that connect to the resistive element 3 and are formed so as to cover both end portions of the insulation substrate 1; a barrier layer 8 that is formed on the surface of each of the internal electrodes and has nickel as a main ingredient; and an external connection layer 9 that is formed on the surface of each of the barrier layers 8 and has tin as a main ingredient. The barrier layers 8 are composed of a nickel and phosphorus (Ni-P) alloy plating formed via electrolytic plating, and at least an inner region of each of the barrier layers 8 is made magnetic by differentiating the phosphorus content of the alloy plating in the inner region from the phosphorous content of the alloy plating in an outer region.
Inventors:
AKAHANE YASUSHI (JP)
TAMADA NOBUHIKO (JP)
TAMADA NOBUHIKO (JP)
Application Number:
PCT/JP2020/036055
Publication Date:
April 22, 2021
Filing Date:
September 24, 2020
Export Citation:
Assignee:
KOA CORP (JP)
International Classes:
C25D5/12; C25D5/14; C25D7/00; H01C1/142; H01C1/148; H01C7/00
Foreign References:
| US20150357097A1 | 2015-12-10 | |||
| JP2001110601A | 2001-04-20 | |||
| JPH1167588A | 1999-03-09 | |||
| JPS58107605A | 1983-06-27 | |||
| JPH03214601A | 1991-09-19 | |||
| JP2019117900A | 2019-07-18 | |||
| JPH10223403A | 1998-08-21 | |||
| JPH11224809A | 1999-08-17 |
Attorney, Agent or Firm:
THE PATENT BODY CORPORATE TAKEWA INTERNATIONAL PATENT OFFICE (JP)
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