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Title:
CHIP AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/036094
Kind Code:
A1
Abstract:
A chip (300) and an electronic apparatus. The chip (300) comprises a storage module, pins (302), a control module (303), first connecting lines (306, 307) and second connecting lines (304, 305). The storage module comprises a first storage array group (1000) and a second storage array group (2000), and the first storage array group (1000) and the second storage array group (2000) respectively comprise a plurality of storage arrays (301); the pins (302) are located on the side face, away from the second storage array group (2000), of the first storage array group (1000); the control module (303) is located between the first storage array group (1000) and the second storage array group (2000); the first connecting lines (306, 307) are connected to the pins (302) and the control module (303); and the second connecting lines (304, 305) are connected to the control module (303), the first storage array group (1000) and the second storage array group (2000), wherein the lengths of the first connecting lines (306, 307) are less than the length from the control module (303) to the side, away from the control module (303), of the second storage array group (2000). The chip (300) reduces parasitic capacitance introduced by the first connecting lines (306, 307).

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Inventors:
JI KANGLING (CN)
LI HONGWEN (CN)
TIAN KAI (CN)
Application Number:
PCT/CN2019/124626
Publication Date:
March 04, 2021
Filing Date:
December 11, 2019
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L27/108; G11C5/06; G11C7/02; G11C11/41
Foreign References:
CN210156118U2020-03-17
JPH0922990A1997-01-21
CN1158178A1997-08-27
US5742551A1998-04-21
US5867446A1999-02-02
US20020145923A12002-10-10
Other References:
See also references of EP 3937239A4
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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