Title:
CHIP, CHIP ENCAPSULATION STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/253254
Kind Code:
A1
Abstract:
Disclosed are a chip, a chip encapsulation structure and an electronic device, which relate to the technical field of chips. In the chip, a secure area and a non-secure area are constructed, the secure area being connected to the non-secure area; the secure area comprises a storage module, a storage protection module and a security detection module; the storage protection module is respectively connected to the storage module and the security detection module; the storage module stores chip data to be protected; the storage protection module is used for transmitting, when received access data from the non-secure area meets a specified permission, said chip data to the non-secure area, and outputting said chip data by means of the non-secure area; and the security detection module is used for detecting a power failure attack on the chip. According to the chip, the chip encapsulation structure and the electronic device provided in the embodiments of the present application, by dividing the chip into a secure area and a non-secure area, and performing security protection on chip data to be protected that is stored in the secure area, the security of the chip is improved.
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Inventors:
GUO ZILIANG (CN)
Application Number:
PCT/CN2020/096462
Publication Date:
December 23, 2021
Filing Date:
June 17, 2020
Export Citation:
Assignee:
SHENZHEN HEYTAP TECH CORP LTD (CN)
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
G06F12/16; G06F21/00; G11C16/02
Foreign References:
| CN103778959A | 2014-05-07 | |||
| CN103679011A | 2014-03-26 | |||
| CN101281563A | 2008-10-08 | |||
| US20130268740A1 | 2013-10-10 |
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
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