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Patent Searching and Data


Title:
CHIP FAILURE LOCATING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/004438
Kind Code:
A1
Abstract:
Disclosed in embodiments of the present application is a chip failure locating method, comprising the following steps: on the basis of the connection between a chip and an adapter board, acquiring an emission microscope analysis (EMMI) rendering of the chip under a connection means, wherein the connection between the chip and the adapter board is a connection that is carried out by using a wire bending machine to connect a pin to be tested of the chip to a designated pin of the adapter board; on the basis of the EMMI rendering, determining whether the chip has failed; and in the situation in which the chip is determined to have failed, determining the location of chip failure.

Inventors:
SHAN SHUSHAN (CN)
CHEN YANNING (CN)
FU ZHEN (CN)
ZHAO YANG (CN)
PAN CHENG (CN)
Application Number:
PCT/CN2020/100497
Publication Date:
January 14, 2021
Filing Date:
July 06, 2020
Export Citation:
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Assignee:
BEIJING SMARTCHIP MICROELECTRONICS TECH CO LTD (CN)
STATE GRID INFORMATION & TELECOMMUNICATION GROUP CO LTD (CN)
International Classes:
H01L21/66
Foreign References:
CN110299299A2019-10-01
CN102116838A2011-07-06
CN103487744A2014-01-01
CN102129026A2011-07-20
DE10005312C22003-09-25
JP2006275835A2006-10-12
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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