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Patent Searching and Data


Title:
CHIP ON FILM ASSEMBLY AND DISPLAY PANEL ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/027076
Kind Code:
A1
Abstract:
A chip on film assembly (10), comprising: a substrate (100) comprising a first auxiliary area (101), a second auxiliary area (102), and a chip on film area (103), wherein the first auxiliary area (101), the chip on film area (103), and the second auxiliary area (102) are sequentially arranged along a first direction; multiple signal wirings (130) are arranged both on one side of the chip on film area (103) close to the first auxiliary area (101) and on one side of the chip on film area (103) close to the second auxiliary area (102); and both the first auxiliary area (101) and the second auxiliary area (102) are used for preventing the signal wirings (130) from being disconnected.

Inventors:
FU XIAOLI (CN)
Application Number:
PCT/CN2019/114000
Publication Date:
February 18, 2021
Filing Date:
October 29, 2019
Export Citation:
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Assignee:
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
G09F9/00
Foreign References:
CN100495147C2009-06-03
CN1971345A2007-05-30
CN1984524A2007-06-20
CN101118888A2008-02-06
CN101136387A2008-03-05
US20160218053A12016-07-28
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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