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Title:
CHIP PACKAGING BODY AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/052209
Kind Code:
A1
Abstract:
A chip packaging body and a preparation method therefor. The chip packaging body comprises a packaging base (1), a packaging housing (2), an insulating plate (3), a chip assembly (4), a pin wiring board (5), an anti-static sleeve (6), a packaging cover plate (7), packaging pins (8), and a packaging substrate (9), wherein the top end surface of the packaging substrate (9) is provided with the packaging base (1), the top end surface of the packaging base (1) is provided with the packaging housing (2), the insulating plate (3) is installed on the bottom part of the inner side of the packaging housing (2), the pin wiring board (5) is installed on the bottom end surface of the insulating plate (3), the packaging pins (8) are plugged and mounted at the outer periphery of the pin wiring board (5), and one end of each packaging pin (8) is sleeved with the anti-static sleeve (6). The chip packaging body is small in size and has a good protection effect. When used, the chip packaging body has a good signal transmission effect, and sensitive signal sensing. Meanwhile, during the packaging process, the packaging body has a good drying effect, so that the sealing performance of a chip can be improved, and the sealing effect is good.

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Inventors:
HUANG XIAOBO (CN)
ZHAO FANKUI (CN)
Application Number:
PCT/CN2020/121391
Publication Date:
March 17, 2022
Filing Date:
October 16, 2020
Export Citation:
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Assignee:
ANHUI LONGXINWEI TECH CO LTD (CN)
International Classes:
H01L23/31; F26B21/00; H01L21/50; H01L21/56; H01L23/053; H01L23/60
Foreign References:
US6058020A2000-05-02
US4330683A1982-05-18
US6255728B12001-07-03
CN101847615A2010-09-29
CN102169877A2011-08-31
CN207320095U2018-05-04
CN208655634U2019-03-26
Attorney, Agent or Firm:
BEIJING HESHINIP INTELLECTUAL PROPERTY OFFICE (CN)
Download PDF:
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