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Patent Searching and Data


Title:
CHIP PACKAGING MODULE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE WITH CHIP PACKAGING MODULE
Document Type and Number:
WIPO Patent Application WO/2021/109443
Kind Code:
A1
Abstract:
Disclosed are a chip packaging module and a packaging method thereof, and an electronic device with the chip packaging module. The chip packaging module comprises: a chip (15); a package substrate (10), which faces the chip (15), a cavity being formed therebetween; a first packaging layer (17) for packaging the chip (15) on the package substrate (10); and a second packaging layer (19), which covers an outer side of the first packaging layer (17), wherein the first packaging layer (17) comprises an extension part extending outwards in the transverse direction of the package substrate (10), a lower side of the extension part covers an upper side of the package substrate (10), and an end part of the second packaging layer (19) is in surface contact with an upper side of the extension part.

Inventors:
PANG WEI (CN)
WANG YUNFENG (CN)
YANG QINGRUI (CN)
ZHANG MENGLUN (CN)
Application Number:
PCT/CN2020/088704
Publication Date:
June 10, 2021
Filing Date:
May 06, 2020
Export Citation:
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Assignee:
UNIV TIANJIN (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H03H3/007; H01L23/31; H03H9/02
Domestic Patent References:
WO2014187505A12014-11-27
Foreign References:
CN101599468A2009-12-09
CN105958963A2016-09-21
CN106301279A2017-01-04
CN101261964A2008-09-10
US20110115036A12011-05-19
Attorney, Agent or Firm:
BEIJING JINCHENG TONGDA & NEAL LAW FIRM (CN)
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