Title:
CHITIN-MODIFIED PP SPUNBONDED NON-WOVEN FABRIC
Document Type and Number:
WIPO Patent Application WO/2021/120446
Kind Code:
A1
Abstract:
A chitin-modified PP spunbonded non-woven fabric, containing 0.2-1.5% of chitosan. A chitosan-modified PP spunbonded non-woven fabric is less than or equal to one grade in mildew grade and greater than or equal to 99.5% in an antibacterial rate. According to the chitosan-modified PP spunbonded non-woven fabric, modified chitin is added, and in a chitin modification process, a modification process flow is optimized, and a standing step is removed, so that the modification time of the chitosan is greatly reduced by 3-5 times, and the production efficiency is improved.
Inventors:
HUANG XIAOHUA (CN)
LIU YANMING (CN)
HUANG XIAOQIAN (CN)
LIU YANMING (CN)
HUANG XIAOQIAN (CN)
Application Number:
PCT/CN2020/082969
Publication Date:
June 24, 2021
Filing Date:
April 02, 2020
Export Citation:
Assignee:
SINOTECH ACAD OF TEXTILE QINGDAO CO LTD (CN)
BESTEE MAT TSINGTAO CO LTD (CN)
BESTEE MAT TSINGTAO CO LTD (CN)
International Classes:
D01F1/10; D04H1/4291; D01F6/46
Foreign References:
CN110894642A | 2020-03-20 | |||
CN108560149A | 2018-09-21 | |||
CN108560149A | 2018-09-21 | |||
CN107129543A | 2017-09-05 | |||
CN109642377A | 2019-04-16 | |||
CN110234804A | 2019-09-13 | |||
US20100211034A1 | 2010-08-19 | |||
CN105008607A | 2015-10-28 |
Attorney, Agent or Firm:
SHANDONG JINAN QILU SCIENCE PATENT OFFICE LTD (CN)
Download PDF:
Previous Patent: DRIVE CIRCUIT, AND RELATED CIRCUIT AND DEVICE
Next Patent: POCKETED SPRING CORE MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD
Next Patent: POCKETED SPRING CORE MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD