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Patent Searching and Data


Title:
CIRCUIT BOARD ASSEMBLY, BACKPLANE INTERCONNECTION SYSTEM AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/036688
Kind Code:
A1
Abstract:
A circuit board assembly, a backplane interconnection system and an electronic device. The circuit board assembly comprises a bracket (1) and a circuit board (2). Fixed parts (201) and free parts (202) are formed on the circuit board, the fixed parts are connected to the bracket, and the free parts are suspended. The plane on which the free parts and the fixed parts are co-located is a first plane, the free parts have swinging momentum along a first direction, and the first direction and the first plane are perpendicular to each other. The circuit board is used for inserting front sub-circuit boards (3), the free parts are provided with first connectors (203) into which first insertion terminals (301) on the front sub-circuit boards are inserted, and the swinging momentum may enable the first connectors and the first insertion terminals to be in insertion connection. The circuit board assembly has a relatively large tolerance capacity for accommodating first insertion terminals, and simplifies the structure and assembly process of the sub-circuit boards.

Inventors:
XU HUAHUA (CN)
GONG XINHU (CN)
TANG YINZHONG (CN)
Application Number:
PCT/CN2020/106487
Publication Date:
March 04, 2021
Filing Date:
August 01, 2020
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01R12/73
Foreign References:
US20150173193A12015-06-18
CN110635274A2019-12-31
US20080032517A12008-02-07
US5260854A1993-11-09
US20060223343A12006-10-05
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