Title:
CIRCUIT BOARD DEVICE AND BOARD CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2019/244864
Kind Code:
A1
Abstract:
The present invention prevents solder joint breakage caused by thermal deformation of a molded body. A circuit board device (A) that comprises: a circuit board (10); a cover (32) and a molded body (52) that are provided to the circuit board (10); and a board connector (11) that is surface mounted on the circuit board (10). The board connector (11) has: a housing (13); and metal members (24, 29) that are integrally attached to the housing (13). The board connector (11) is surface mounted on the circuit board (10) by solder joining of the metal members (24, 29). The molded body (52) comprises a synthetic resin material and encloses the solder-joined circuit board (10) and metal members (24, 29). The cover (32) is embedded in the molded body (52) so as to surround the metal members (24, 29).
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Inventors:
ASANO YASUNORI (JP)
KUBOTA MOTOKI (JP)
KUBOTA MOTOKI (JP)
Application Number:
PCT/JP2019/024027
Publication Date:
December 26, 2019
Filing Date:
June 18, 2019
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/51; H01R13/504; H01R43/24
Foreign References:
| JP2010212196A | 2010-09-24 | |||
| JP2013247057A | 2013-12-09 | |||
| JPH08306425A | 1996-11-22 | |||
| JP2015041510A | 2015-03-02 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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