Title:
CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/196616
Kind Code:
A1
Abstract:
Provided is a circuit board in which the delamination of an Ni film can be suppressed. Also provided is an electronic device and an electronic module provided with said circuit board. The circuit board comprises: an insulative substrate that comprises a first face and a second face on the opposite side from the first face, and contains AlN; a conductor that is positioned on the first face and contains Cu; and a Ni film that is positioned across the upper surface, side surfaces, and the first face of the conductor. A plurality of spots of Ti oxide are present on the first face, and the Ni film comprises a portion that contacts the Ti oxide.
Inventors:
TAKESHIMA YUKI (JP)
HOSOI YOSHIHIRO (JP)
HOSOI YOSHIHIRO (JP)
Application Number:
PCT/JP2020/013314
Publication Date:
October 01, 2020
Filing Date:
March 25, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H01L23/12; H05K3/18; H05K3/24; H05K3/38
Domestic Patent References:
| WO2016056203A1 | 2016-04-14 | |||
| WO2017126641A1 | 2017-07-27 |
Foreign References:
| JP2014053619A | 2014-03-20 | |||
| JPH11135900A | 1999-05-21 |
Other References:
See also references of EP 3951852A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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