CIRCUIT BOARD AND ELECTRONIC DEVICE

WIPO Patent Application WO/2022/124038

A1

According to the present invention, a first waveguide conductor layer is provided to an element body. A second waveguide conductor layer is provided to the element body, and is located below the first waveguide conductor layer. A plurality of first interlayer connection conductors are electrically connected to the first waveguide conductor layer and the second waveguide conductor layer, and are aligned in a first propagation direction of a first high-frequency signal. A plurality of second interlayer connection conductors are electrically connected to the first waveguide conductor layer and the second waveguide conductor layer, and are aligned in the first propagation direction at positions spaced from the plurality of first interlayer connection conductors in a first orthogonal direction. The element body includes a porous region having a porous structure. At least part of the porous region is located in a region surrounded by the first waveguide conductor layer, the second waveguide conductor layer, the first interlayer connection conductor, and the second interlayer connection conductor as viewed from the first propagation direction.

IKEMOTO NOBUO (JP)
MATSUMOTO MITSUHIRO (JP)

PCT/JP2021/042419

June 16, 2022

November 18, 2021

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MURATA MANUFACTURING CO (JP)

H01P5/107; H01P3/12; H05K1/03

JP2013126099A	2013-06-24
JP2015188144A	2015-10-29
JP2003115705A	2003-04-18
JPH02214202A	1990-08-27
JPH04188691A	1992-07-07
JPH0393301A	1991-04-18
JP2009055574A	2009-03-12
JP2010074255A	2010-04-02

KAEDE PATENT ATTORNEYS' OFFICE (JP)

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