Title:
CIRCUIT BOARD STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/179504
Kind Code:
A1
Abstract:
Disclosed is a circuit board structure (30), comprising a main body (320) and a plurality of bonding pads (310). A chip mounting area (330) is arranged on the surface of the main body (320). The plurality of bonding pads (310) comprise at least one first bonding pad (311) and a plurality of second bonding pads (312), wherein the at least one first bonding pad (311) is located at a corner position close to the chip mounting area (330); the plurality of second bonding pads (312) are distributed at a central area (331) of the chip mounting area (330) and same are distributed around the at least one first bonding pad (311); the area of the first bonding pad (311) is three times larger than the areas of the second bonding pads (312); and the first bonding pad (311) is used for bonding at least two independent bonding pads (310) on the side of a chip (20). In the circuit board, the first bonding pad (311) is arranged in an edge area (332) of the chip mounting area (330), and the area of the first bonding pad (311) is three times larger than the areas of the second bonding pads (312), such that the design increases the areas of combination of the bonding pads (310) and the chip (20), solves the problem of the mechanical reliability of connection between the chip (20) and the circuit board structure (30), can reduce the amount of glue dispensing between the chip (20) and the circuit board structure (30) and even achieves a non-glue dispensing effect, and solves the problems that in glue dispensing, welding spots of glue dispensing elements are repaired and dewetted, sensitive element gluing fails, the cost is increased, etc.
More Like This:
| JPS5713674 | PRINTED CIRCUIT BOARD |
| JP3550281 | WIRING BOARD AND ITS MANUFACTURING METHOD |
Inventors:
SHI HONGBIN (CN)
CHEN XI (CN)
TU HAISHENG (CN)
CHEN XI (CN)
TU HAISHENG (CN)
Application Number:
PCT/CN2020/101905
Publication Date:
September 16, 2021
Filing Date:
July 14, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/11
Foreign References:
| CN1396799A | 2003-02-12 | |||
| CN102843861A | 2012-12-26 | |||
| CN102548204A | 2012-07-04 | |||
| CN103943598A | 2014-07-23 | |||
| US20090045508A1 | 2009-02-19 | |||
| CN203590596U | 2014-05-07 | |||
| CN202020317937U | 2020-03-13 |
Download PDF: