Title:
CIRCUIT COMPOSITE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/218384
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel circuit composite structure. The structure comprises a fiber-reinforced resin and a wire, wherein the wire is embedded in the fiber-reinforced resin.
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Inventors:
MACHIDA HIDEAKI (JP)
HIDAKA SHOTARO (JP)
KIYAMA KOSHI (JP)
HIDAKA SHOTARO (JP)
KIYAMA KOSHI (JP)
Application Number:
PCT/JP2020/017409
Publication Date:
October 29, 2020
Filing Date:
April 22, 2020
Export Citation:
Assignee:
DU PONT TORAY CO LTD (JP)
TORAY INDUSTRIES (JP)
TORAY INDUSTRIES (JP)
International Classes:
H05K1/02; B32B15/14; H05K3/00; H05K3/28
Foreign References:
| US20130160291A1 | 2013-06-27 | |||
| US3700825A | 1972-10-24 | |||
| JP3146586U | 2008-11-20 | |||
| JPH05267502A | 1993-10-15 |
Attorney, Agent or Firm:
IWATANI, Ryo (JP)
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