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Patent Searching and Data


Title:
CIRCUIT CONSTRUCTION
Document Type and Number:
WIPO Patent Application WO/2021/235445
Kind Code:
A1
Abstract:
Disclosed is a circuit construction having a novel structure with which it is possible to quickly reduce heat generated in a connection portion of a heat-generating component. A circuit construction 10 comprises: a heat-generating component 12 which generates heat when energized; an energization member 16 connected to a connection portion 14 of the heat-generating component 12; a fastening member 18 for fastening the energization member 16 to the connection portion 14; and a thermal capacity increasing component 20 which is in thermal contact with the area in which the energization member 16 and the connection portion 14 are fastened to each other, and which increases the thermal capacity of the connection portion 14 of the heat-generating component 12.

Inventors:
IGURA KOUSHI (JP)
SHIMODA HIROKI (JP)
YANAGIDA TAIJI (JP)
Application Number:
PCT/JP2021/018837
Publication Date:
November 25, 2021
Filing Date:
May 18, 2021
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01H45/12; H02G3/16; H05K7/06; H05K7/20
Foreign References:
JPH09284951A1997-10-31
JP2014079093A2014-05-01
JPH09293907A1997-11-11
JPH0658226U1994-08-12
JP2010161417A2010-07-22
JP2006179627A2006-07-06
JP2018206601A2018-12-27
JPS6091867A1985-05-23
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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