CIRCUIT DEVICE - AUTONETWORKS TECHNOLOGIES LTD

Title:

CIRCUIT DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/009148

Kind Code:

A1

Abstract:

This ECU 1 is provided with a circuit substrate 10, a connector 20 which is fixed to the circuit substrate 10, and a resin part 50 which covers the circuit substrate 10 and the connector 20, and a buffer part 60 is interposed between the circuit substrate 10 and the connector 20, between the circuit substrate 10 and the resin part 50, and between the connector 20 and the resin part 50. With this structure, it is possible for the elastic buffer part 60 to absorb stress occurring in the boundary part between the circuit substrate 10 and the connector 20, the boundary part between the circuit substrate 10 and the resin part 50, and the boundary part between the connector 20 and the resin part 50 due to differences in linear expansion coefficients. In this way, it is possible to avoid the connector 20 peeling off of the circuit substrate 10.

Inventors:

KOMORI HIROKAZU (JP)
HIRAI HIROKI (JP)
EGUCHI HIROKAZU (JP)

Application Number:

PCT/JP2018/024278

Publication Date:

January 10, 2019

Filing Date:

June 27, 2018

Export Citation:

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Assignee:

AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

International Classes:

H01R13/52; H01R12/71; H01R43/00

Domestic Patent References:

WO2014132973A1

2014-09-04

Foreign References:

JPS5844777U	1983-03-25
JP2007255275A	2007-10-04
JP2012138178A	2012-07-19
JP2009200116A	2009-09-03
JP2010055866A	2010-03-11