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Patent Searching and Data


Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2020/166445
Kind Code:
A1
Abstract:
A circuit module (1) is provided with a circuit board (2), an insulating protective member (3) disposed on the circuit board (2), and a fuse element (4) mounted on the circuit board (2) with the insulating protective member (3) interposed therebetween, wherein: the fuse element (4) is provided with an insulating board (40), and a case (50) covering a surface of the insulating board (40); the case (50) has a through hole (52) in a side surface (51); and the fuse element (4) is disposed inward of an outer periphery of the insulating protective member (3) as seen in a plan view.

Inventors:
KOMORI CHISATO (JP)
YONEDA YOSHIHIRO (JP)
Application Number:
PCT/JP2020/004325
Publication Date:
August 20, 2020
Filing Date:
February 05, 2020
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01H85/175; H01H37/76
Foreign References:
JP2016134317A2016-07-25
JP2010272215A2010-12-02
JP2006185951A2006-07-13
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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