Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2022/153789
Kind Code:
A1
Abstract:
This circuit module (10) is provided with: a substrate (20) that has a first main surface (201); an electronic component (30) of an acoustic wave filter, said electronic component (30) being mounted on the first main surface (201); an insulating resin layer (50) that covers the first main surface (201) side; and an electroconductive shielding film (60) that covers the outer surface of the insulating resin layer (50). The shielding film (60) is provided with a top surface part (601) that is positioned on the reverse side from the substrate (20) with respect to the electronic component (30). The top surface part (601) and the electronic component (30) are in contact with each other. The outer surface of the top surface part (601) has recesses and protrusions.

More Like This:
WO/2016/167526ULTRASONIC-WELDING JOINING APPARATUS OF SEMICONDUCTOR SUBSTRATE
JPH0212952HEAT SINK
JPH0625016[Name of invention] Directional alignment mechanism of semiconductor device
Inventors:
INAO TAKESHI (JP)
Application Number:
PCT/JP2021/046784
Publication Date:
July 21, 2022
Filing Date:
December 17, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L25/04; H01L25/18; H03H9/25; H05K7/20; H05K9/00
Domestic Patent References:
WO2007114224A12007-10-11
WO2011004665A12011-01-13
WO2018181708A12018-10-04
WO2016117196A12016-07-28
WO2018135555A12018-07-26
WO2018123381A12018-07-05
Foreign References:
JP2019165121A2019-09-26
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: AR PILOTING SYSTEM AND AR PILOTING METHOD

Next Patent: MARTENSITE-BASED STAINLESS STEEL MATERIAL AND METHOD FOR PRODUCING SAME