Title:
CIRCUIT SHEET, SENSOR SHEET, AND FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/027034
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain a film-forming composition for forming a film that comprises a thinned protective film and has an excellent-circuit wiring- or sensor-electrode-protection performance, and to obtain a circuit sheet or a sensor sheet in which circuit wiring or a sensor electrode is protected by the coating. The present invention provides a circuit sheet or a sensor sheet including a thermoplastic resin that is at least one of an epoxy resin, a phenoxy resin, polyvinyl alcohol, polyvinyl acetal, polyvinyl butyral, or an ethylene-vinyl alcohol copolymer, the thermoplastic resin having a hydrogen-bonding functional group and having a glass transition temperature Tg from 70°C to 150°C.
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Inventors:
TOMOOKA SHINICHI (JP)
MIYANAGA KANAE (JP)
MIYANAGA KANAE (JP)
Application Number:
PCT/JP2022/031597
Publication Date:
March 02, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L29/14; C08L71/08; C08L101/02; C09D129/02; C09D129/14; C09D163/02; C09D171/10; H05K3/28
Domestic Patent References:
| WO2018181386A1 | 2018-10-04 |
Foreign References:
| JPH11140147A | 1999-05-25 | |||
| JP2001044474A | 2001-02-16 | |||
| JP2006227418A | 2006-08-31 | |||
| JP2016027097A | 2016-02-18 | |||
| JP2017124497A | 2017-07-20 | |||
| JP6167103B2 | 2017-07-19 |
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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