Title:
CLEANING AGENT COMPOSITION, METHOD FOR CLEANING SUBSTRATE, AND METHOD FOR CLEANING SUPPORT BODY OR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/235605
Kind Code:
A1
Abstract:
This cleaning agent composition is used to remove a temporary adhesive material containing a silicone compound present on a substrate. The cleaning agent composition contains 75-99 parts by mass of an organic solvent (A), 0-5 parts by mass of water (B), and 1-20 parts by mass of an ammonium salt (C) (the total amount of components (A), (B) and (C) is 100 parts by mass). The organic solvent does not contain a hydroxyl group-containing organic solvent, and contains a heteroatom-containing organic solvent at a quantity of 50 parts by mass or more relative to 100 parts by mass of the organic solvent. The ammonium salt contains at least one of a hydroxide ion, a fluoride ion or a chloride ion.
Inventors:
TANABE MASAHITO (JP)
SUGO MICHIHIRO (JP)
SUGO MICHIHIRO (JP)
Application Number:
PCT/JP2020/019986
Publication Date:
November 26, 2020
Filing Date:
May 20, 2020
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
B08B3/08; C11D7/22; C11D7/32; H01L21/304
Domestic Patent References:
| WO2014092022A1 | 2014-06-19 | |||
| WO2015115060A1 | 2015-08-06 |
Foreign References:
| US20170158888A1 | 2017-06-08 | |||
| JP2009224793A | 2009-10-01 | |||
| JP2015007217A | 2015-01-15 | |||
| JP2012144616A | 2012-08-02 | |||
| JP2014131004A | 2014-07-10 |
Other References:
See also references of EP 3974070A4
Attorney, Agent or Firm:
TORANOMON INTELLECTUAL PROPERTY FIRM (JP)
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