Title:
CLEANING APPARATUS FOR SEMICONDUCTOR SUBSTRATES AND CLEANING METHOD FOR SEMICONDUCTOR SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2018/146847
Kind Code:
A1
Abstract:
A cleaning apparatus 10 for semiconductor substrates, which cleans a semiconductor substrate with use of ozone water, and which is provided with: a cooling means 3 for cooling ozone water W2 at a temperature of 20°C or more down to a predetermined temperature; and a cleaning means 4 for cleaning a substrate by means of ozone water W3 which has been cooled by the cooling means 3. The cleaning means 4 comprises a cleaning tank 41 in which the substrate is immersed and cleaned in the ozone water W3, which has been cooled by the cooling means 3. According to a cleaning method that uses this cleaning apparatus 10 for semiconductor substrates, a semiconductor substrate is immersed in ozone water, so that the loss of a substrate material during a cleaning step is able to be reduced, while removing foreign metal substances and organic substances such as resists remaining on the substrate surface by cleaning.
Inventors:
FUJIMURA YU (JP)
Application Number:
PCT/JP2017/032789
Publication Date:
August 16, 2018
Filing Date:
September 12, 2017
Export Citation:
Assignee:
KURITA WATER IND LTD (JP)
International Classes:
B01F23/80; H01L21/304; B01F23/70
Foreign References:
| JP2007150164A | 2007-06-14 | |||
| JP2003109928A | 2003-04-11 | |||
| JP2014093357A | 2014-05-19 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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