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Patent Searching and Data


Title:
CLEANING RESIN COMPOSITION FOR INJECTION MOLDING MACHINES AND MOLDS
Document Type and Number:
WIPO Patent Application WO/2019/069798
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cleaning resin composition for injection molding machines and molds, which has excellent thermal stability, while having excellent cleaning properties and excellent substitution properties. A cleaning resin composition for injection molding machines and molds according to the present invention is characterized by containing a thermoplastic resin and a surfactant which has a decomposition initiation temperature of TGA of 200°C or higher and a melting point of less than 100°C.

Inventors:
YAMAUCHI NORIKO (JP)
Application Number:
PCT/JP2018/036089
Publication Date:
April 11, 2019
Filing Date:
September 27, 2018
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C11D3/37; B29C33/72; C11D1/28; C11D3/06
Foreign References:
JPH11227000A1999-08-24
JP2002001734A2002-01-08
JP2012121953A2012-06-28
JP2005035121A2005-02-10
JP2010269519A2010-12-02
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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