[0001] The present application claims the priority benefit of U.S. Provisional Patent Application Serial No. 62/851 ,469, filed May 22, 2019, the disclosure of which is incorporated by reference herein.

BACKGROUND

[0002] Physical vapor deposition (PVD) is useful for applying aesthetic and functional layers to a substrate in order to produce various parts. One common area of PVD parts relates to various automotive parts for both internal and external mounting on a vehicle, although this disclosure is not limited to the automotive industry and may find suitable application in a wide variety of industries and end uses. However, multilayer parts often exhibit poor interlayer adhesion and other deficiencies that could be attributable to a wide variety of reasons such as steps of manufacture, materials used in the process/part manufacture or assembly, exposure to temperature, moisture, pressure/forces, ultraviolet light exposure, chemicals (e.g., solvents, salts, detergents, etc.), although this list is merely exemplary and not deemed to be exhaustive.

[0003] It would be desirable to develop new PVD systems and methods for producing parts which overcome one or more of these deficiencies, or still other unmentioned deficiencies or challenges.

BRIEF DESCRIPTION

[0004] The present disclosure relates to physical vapor deposition (PVD) processes, apparatuses, and parts. In the processes, multiple layers are applied to a substrate via PVD. The layers are preferably applied in separate chambers of a PVD apparatus where the chambers are separated by interlocks. In a first chamber(but not necessarily the first chamber of the device), a first layer (e.g., a Cr adhesion layer) is applied in the absence of a reactive gas. In a second chamber, a second layer (e.g., a silicon dioxide layer) is applied in the presence of a reactive gas. [0005] Disclosed, in some embodiments, is a method for producing a part. The method includes providing a plastic substrate coated with a base coat layer to a first chamber of a physical vapor deposition (PVD) apparatus; surface treating the plastic substrate coated with the base coat layer to achieve a desired surface energy in a first chamber; applying a metal adhesion layer via PVD in a second chamber of the PVD apparatus in the absence of oxygen gas, wherein the first chamber is separated from the second chamber by a first seal; applying a first S1O2 layer via reactive PVD in a third chamber of the PVD apparatus, wherein the second chamber is separated from the third chamber by a second seal; applying an appearance layer comprising at least one metal element and/or at least one metalloid element via PVD in a fourth chamber of the PVD apparatus in the absence of oxygen gas, wherein the third chamber is separated from the fourth chamber by a third seal; and applying a second S1O2 layer via reactive PVD in a fifth chamber of the PVD apparatus, wherein the fourth chamber is separated from the fifth chamber by a fourth seal.

[0006] In some embodiments, the method further includes: applying an organic top coat layer after the part is removed from the PVD apparatus.

[0007] Disclosed, in other embodiments, is a method for producing a part. The method includes applying a first layer to a substrate in a first chamber via physical vapor deposition (PVD) in the absence of reactive gas; and applying a second layer to the substrate in a second chamber via PVD in the presence of reactive gas.

[0008] Disclosed, in further embodiments, is an apparatus for coating a substrate. The apparatus includes a first chamber configured for non-reactive physical vapor deposition; and a second chamber configured for reactive physical vapor deposition; a transportation system for moving a fixture between the first chamber and the second chamber; wherein the first chamber and the second chamber are separated by an interlock to prevent contamination.

[0009] Parts produced using the apparatuses, methods, and systems of the present disclosure are also disclosed.

[0010] These and other non-limiting characteristics of the disclosure are more particularly disclosed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 is a flow chart illustrating a physical vapor deposition (PVD) process in accordance with some embodiments of the present disclosure.

[0012] FIG. 2 is a first part produced via a PVD process in accordance with some embodiments of the present disclosure.

[0013] FIG. 3 is a second part produced via a PVD process in accordance with some embodiments of the present disclosure.

[0014] FIG. 4 is a schematic diagram of a machine in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

[0015] The present disclosure may be understood more readily by reference to the following detailed description of desired embodiments included therein. In the following specification and the claims which follow, reference will be made to a number of terms which shall be defined to have the following meanings.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. In case of conflict, the present document, including definitions, will control. Preferred methods and materials are described below, although methods and materials similar or equivalent can be used in practice or testing of the present disclosure. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety. The materials, methods, and articles disclosed herein are illustrative only and not intended to be limiting.

[0017] The singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise.

[0018] As used in the specification and in the claims, the term “comprising” may include the embodiments “consisting of” and “consisting essentially of.” The terms “comprise(s),”“include(s),”“having,”“has,”� �can,”“contain(s),” and variants thereof, as used herein, are intended to be open-ended transitional phrases that require the presence of the named ingredients/steps and permit the presence of other ingredients/steps. However, such description should be construed as also describing compositions, mixtures, or processes as“consisting of and“consisting essentially of” the enumerated ingredients/steps, which allows the presence of only the named ingredients/steps, along with any impurities that might result therefrom, and excludes other ingredients/steps.

[0019] Unless indicated to the contrary, the numerical values in the specification should be understood to include numerical values which are the same when reduced to the same number of significant figures and numerical values which differ from the stated value by less than the experimental error of the conventional measurement technique of the type used to determine the particular value.

[0020] All ranges disclosed herein are inclusive of the recited endpoint and independently combinable (for example, the range of “from 2 to 10” is inclusive of the endpoints, 2 and 10, and all the intermediate values). The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value; they are sufficiently imprecise to include values approximating these ranges and/or values.

[0021] As used herein, approximating language may be applied to modify any quantitative representation that may vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about” and“substantially,” may not be limited to the precise value specified, in some cases. The modifier“about” should also be considered as disclosing the range defined by the absolute values of the two endpoints. For example, the expression“from about 2 to about 4” also discloses the range“from 2 to 4.” The term“about” may refer to plus or minus 10% of the indicated number. For example,“about 10%” may indicate a range of 9% to 1 1 %, and“about 1” may mean from 0.9-1 .1 .

[0022] For the recitation of numeric ranges herein, each intervening number there between with the same degree of precision is explicitly contemplated. For example, for the range of 6-9, the numbers 7 and 8 are contemplated in addition to 6 and 9, and for the range 6.0-7.0, the number 6.0, 6.1 , 6.2, 6.3, 6.4, 6.5, 6.6, 6.7, 6.8, 6.9, and 7.0 are explicitly contemplated.

[0023] The term “physical vapor deposition” (PVD) refers to coating processes wherein material is physically removed from a source (e.g., sputtering target) by evaporation or sputtering. The removed material is transported through a vacuum or partial vacuum by the energy of the vapor particles and condensed as a film on the surface(s) of one or more substrates. In standard sputtering, the source contains or approximates the desired composition for the coating. A plasma such as a non-reactive gas is directed toward a target formed of the material that is to be deposited as a thin film on the substrate surface(s). Particularly, atoms of the target material are ejected or removed by the plasma or gas, and then deposited on the substrate to form the thin film. In reactive sputtering, a gas containing a desired reactant is introduced. The reactant gas reacts with the source material to form the desired coating composition. For example, a metal source material may react with oxygen gas to form a metal oxide coating.

[0024] Non-limiting examples of PVD processes include diode sputtering, triode sputtering, magnetron sputtering (e.g., planar or cylindrical), direct current sputtering, radio frequency sputtering, electron beam evaporation, activated reactive evaporation, and arc evaporation.

[0025] Phases in PVD processes can include emission from a vapor source, vapor transport in a vacuum, and condensation of a substrate to be coated.

[0026] Disclosed, in some embodiments, is a PVD system to make a molded plastic substrate having a galvanic plated decorative finish using PVD coatings. This process is appropriate for any number of various thermoplastic and thermoset plastics.

[0027] FIG. 1 schematically illustrates a physical vapor deposition (PVD) method 100 in accordance with some embodiments of the present disclosure. The method 100 includes forming a plastic substrate 110, but it is also contemplated that the plastic substrate could be a component formed separate and apart from the PVD method, and may be manufactured and/or supplied by a different manufacturer or supplier. The plastic substrate may be made of a thermoplastic polymer composition or a thermosetting polymer composition. The plastic substrate may be formed, for example, via an extrusion process and/or a molding process. Non-limiting embodiments of molding include rotational molding, injection molding, blow molding, compression molding, extrusion molding, and thermoforming.

[0028] Non-limiting examples of substrate materials useful in forming the plastic substrate include polycarbonate (PC) (e.g., LEXAN™ Resin LS1 from SABIC, LG1303), a PC/acrylonitrile-butadiene-styrene blend (PC/ABS) (e.g., CYCOLOY™ Resin XCY620 from SABIC), bulk moulding compound (BMC), polyamide (e.g., nylon), polybutylene terephthalate (PBT), polyester (e.g., polyethylene terephthalate (PET)), a PET/PBT blend, poly(p-phenylene oxide), polyacrylate, polystyrene, polyolefin (e.g., polyethylene, polypropylene), polyimide, and polymethyl methacrylate. The substrate may be smooth or textured. In some embodiments, one or more textured surfaces are generated during moulding. For example, the substrate may have one or more brushed surfaces.

[0029] In some embodiments, the substrate material is suitable for vacuum processes and temperature-resistant up to approximately 80°C or higher.

[0030] Next, a base coat (e.g., an organic base coat) is applied to the plastic substrate. 120. Optionally, a surface of the plastic substrate is treated prior to the application of the base coat. The base coat may be cross-linked (e.g., UV-cured) on the substrate or treated surface of the plastic substrate. The base coat may also be thermally cured. In some embodiments, the base coat is dual-cured (UV-cured and thermally-cured). In some embodiments, the base coat is applied via spray-coating or flow-coating. The base coat may be applied via a single deposition step and a single curing step. Alternatively, deposition and curing may be repeated to build multiple layers of an organic base coat on the plastic substrate. A UV-cured organic base coat serves the purpose of providing a hard coat base from which all subsequent layers get their abrasion resistance. A harder base coat will better support the subsequent layers thereby giving better scratch and abrasion resistance.

[0031] Non-limiting examples of base coat materials include an acrylic polymer, a copolymer of an acrylic monomer and methacryloxysilane, a copolymer of a methacrylic monomer and an acrylic monomer having a benzotriazole group or a benzophenone group, an organo-silicon, an acrylic, a urethane, a melamine, and an amorphous SiOxCyHz. The organo-silicon polymer may be produced by curing a composition containing one or more of the following compounds: trialkoxysilanes or triacyloxysi lanes such as methyltrimethoxysilane, methyltriethoxysilane, methyltrimethoxyethoxysilane, methyltriacetoxysilane, methyltripropoxysilane, methyltributoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltracetoxysilane, vinyltrimethoxyethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriacetoxysilane, gamma-chloropropyltrimethoxysilane, gamma-chloropropyltriethoxysilane, gamma-chloropropyltripropoxysilane, 3,3,3- trifluoropropyltrimethoxysilane gamma-glycidoxypropyltrimethoxysilane, gamma- glycidoxypropyltriethoxysilane, gamma-(beta-glycidoxyethoxy)propyltrimethoxysilane, beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, beta-(3,4- epoxycyclohexyl)ethyltriethoxysilane, gamma-methacryloxypropyltrimethyoxysilane, gamma-aminopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma- meraptopropyltrimethoxysilane, gamma-mercaptopropyltriethoxysilane, N- beta(aminoethyl)-gamma-aminopropyltrimethoxysilane, beta-cyanoethyltriethoxysilane and the like; as well as dialkoxysilanes or diacyloxysilanes such as dimethyldimethoxysilane, phenylmethyldimethoxysilane, dimethyldiethoxysilane, phenylmethyldiethoxysilane, gamma-glycidoxypropylmethyldimethoxysilane, gamma- glycidoxypropylmethyldiethoxysilane, gamma-glycidoxypropylphenyldimethoxysilane, gamma-glycidoxypropylphenyldiethoxysilane, gamma- chloropropylmethyldimethoxysilane, gamma-chloropropylmethyldiethoxysilane, dimethyldiacetoxysilane, gamma-methacryloxypropylmethyldimethoxysilane, gamma- metacryloxypropylmethyldiethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, gamma-mercaptopropylmethyldiethoxysilane, gamma- aminopropylmethyldimethoxysilane, gamma-aminopropylmethyldiethoxysilane, methylvinyldimethoxysilane, methylvinyldiethoxysilane and the like.

[0032] In some embodiments, the base coat is formed from UVB315 from Redspot or hexamethyldisiloxane (Glipoxan).

[0033] The base coat layer may have a thickness in the range of from about 5 to about 50 pm, including from about 10 to about 30 pm, and from about 12 to about 25 pm.

[0034] Substrate formation 110 and base coat application 120 may be performed outside of a PVD apparatus. However, it is also possible to perform the base coat application in an initial chamber of the PVD apparatus prior to the first PVD step. Optionally, the substrate coated with the base coat is immediately transferred to the PVD apparatus. In other embodiments, the coated substrate may be stored prior to transfer to the PVD apparatus. It is also possible that the transfer of the coated substrate to the PVD apparatus is the beginning of the method. For example, the coated substrate may be purchased from another party and/or transferred to the facility housing the PVD apparatus. In embodiments wherein there is a delay between base coat application 120 and transfer to the PVD apparatus, the coated substrate may be subjected to a cleaning or other operation prior to entering the PVD apparatus.

[0035] After the parts are coated with the appropriate base coat, the parts are cured and then transferred into a first chamber of the PVD apparatus. In the first chamber, the coated substrate may be treated to have the proper surface energy 130. The treatment may include a plasma treatment, a corona treatment, and/or a glow-discharge treatment. An improper surface energy can reduce adhesion and cause surface delamination between the substrate and the base coat. Air and/or argon may be used in the process gas during the treatment 130. It is also possible that the base coat is applied in the first chamber of the PVD apparatus (e.g., via plasma-enhanced chemical vapor deposition (PECVD)).

[0036] Next, a thin metal (e.g., Cr and/or Ti) adhesion layer is applied to the active surface 140 in a second PVD chamber which may be separated from the first chamber by an interlock or seal. An inert gas (e.g., a noble gas such as argon gas) may be used as the process gas in this step of the PVD process. In some embodiments, no reactive gas is present in the second chamber. The adhesion layer may have a thickness in the range of from about 1 nm to about 60 nm, including from about 5 nm to about 50 nm, from about 6 to about 40 nm, from about 8 to about 20 nm, and from about 10 to about 15 nm. In particular embodiments, the adhesion layer has a thickness of about 15 nm or about 30 nm. The adhesion layer ensures that layers subsequently applied have good adhesion to the base coat.

[0037] Next, a first S1O2 layer is applied 150 via reactive PVD in a third PVD chamber. Again, the third chamber is preferably separated from the second PVD chamber by a second seal or interlock. The S1O2 layer may have a thickness in the range of from about 50 nm to about 150 nm, including from about 70 nm to about 130 nm, from about 80 nm to about 120 nm, and about 100 nm. The first S1O2 layer may be deposited using mid frequency power supplies in a reactive atmosphere. The process gases may include argon and oxygen. This hard or S1O2 layer acts as a very hard surface on which to deposit the“appearance” layer of metal (to be described below). The application of this hard layer adds to the scratch resistance of the appearance layer. [0038] The first S1O2 layer may be applied 150 in multiple steps in multiple chambers. For example, the first S1O2 layer may be applied 150 in two chambers wherein approximately half of the thickness of the first S1O2 layer is applied in each chamber. The use of multiple chambers to apply one layer in multiple steps may be beneficial where achieving the desired thickness in a single step in a single chamber would take longer than the other steps in the process 100. Using multiple chambers to achieve a desired thickness may allow for continuous processing. In some embodiments, an interface may be detectable between adjacent S1O2 sublayers that were applied in distinct chambers.

[0039] Next, an appearance layer is applied at process step 160 via PVD. In a preferred arrangement, a fourth PVD chamber may be separated from the third PVD chamber by a third seal or interlock. In some embodiments, the process gas includes at least one noble gas (e.g., argon). The appearance layer may be a reflective metal layer. This layer can be made of any number of metals or metalloids. The appearance layer may contain at least one metal element and/or at least one metalloid element. The metal(s) may be selected from Li, Be, Na, Mg, Al, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sn, Cs, Ba, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Hf, Ta, W, Re, Os, Ir, Pt, Au, TI, Pb, Bi, Po, Fr, Ra, Ac, Th, Pa, Np, Pu, Am, Cm, Bk, Cf, Es, Fm, Md, No, Lr, Rf, Db, Sg, Bh, Hs, Mt, Ds, Rg, Cn, Nh, FI, Me, and Lv. The metalloid(s) may be selected from B, Si, Ge, As, Sb, and Te. In some embodiments, the appearance layer contains brass and/or stainless steel. Stainless steel and/or chromium sputtering targets may be used.

[0040] The appearance layer has a preferred thickness in the range of about 10 nm to about 120 nm, including from about 20 nm to about 100 nm, from about 30 nm to about 90 nm, from about 40 nm to about 60 nm, from about 60 nm to about 80 nm, about 50 nm, and about 70 nm. Optionally, nitrogen is incorporated (e.g., from about 5% to about 15%) in this metal layer for reducing stress, added hardness, and abrasion resistance. The nitrogen may be added by including N2 gas in the process gas. For example, the process gas may include a mixture of argon and nitrogen. The inclusion of N2 may lead to the formation of a small amount of a metal nitride. The appearance layer may be applied through the use of two opposing“targets” made of the base metal to be applied. In some embodiments, the appearance layer is applied 160 in multiple steps in multiple chambers. The use of multiple chambers is advantageously employed to match cycle times in each chamber so that parts can advance to subsequent chambers simultaneously. When multiple chambers are used, it is possible that the appearance layer contains two or more distinct sublayers. The sublayers may differ in their composition and/or thickness, although in the preferred arrangement, the separate layers are the same material and about the same thickness as noted above.

[0041] Next, a second S1O2 layer is applied 170 via reactive PVD in a fifth PVD chamber. Once again, the fifth chamber is distinct and sealed by an interlock seal from the adjacent fourth chamber - i.e. , the fifth chamber may be separated from the fourth PVD chamber by a fourth seal or interlock. The preferred process gas may contain argon and nitrogen. This layer acts as a very hard protective wear resistant layer to protect the previous“appearance layer”. The second S1O2 layer may have a thickness in the range of from about 5 nm to about 25 nm, including from about 10 nm to about 20 nm, and about 15 nm.

[0042] In some embodiments, each PVD step or element is sputtering.

[0043] If the part is for an interior or low wear applications, the process 100 may be complete based on the above description of the process. If intended for exterior or high wear applications, an organic top coat may be applied 180 before or after the part is removed from the PVD apparatus. For example, a top coat layer may be applied in the final chamber of the PVD apparatus. The part may be cleaned prior to the application of the top coat but this is not necessarily a required step. The need for a cleaning step before the application of a protective top coat may depend on the length of time that passes before the top coat is applied. It is also possible that the top coat is applied 180 in a sixth chamber (e.g., via PECVD), e.g., immediately after completion of the second S1O2 layer in the fifth chamber. The top coat may have a thickness in the range of about 1 nm to about 20 nm, including about 5 nm to about 15 nm, and about 10 nm.

[0044] Non-limiting examples of suitable top coat materials include the materials disclosed above for the base coat. The top coat and base coat may be the same or different in terms of thickness and/or composition.

[0045] The part may be surface treated after the application of the outermost layer. This surface treatment may be performed in an exit chamber of the PVD apparatus. Non- limiting examples of treatments include a plasma treatment and treatments to alter one or more of the textures, color, hydrophilic/hydrophobic degree, etc.

[0046] The part may be treated to alter the texture, color, hydrophilic/hydrophobic degree, etc.

[0047] To achieve the greatest level of material adhesion, the overall residual surface energy should be in a slight compression. Various aspects of the overall stresses and the difference between layers are discussed in U.S. Pat. No. 9, 176,256 to Hall et at., issued Nov. 3, 2015; the contents of which are incorporated by reference herein.

[0048] The methods of the present disclosure may be performed in an apparatus with a plurality of separated chambers to prevent cross process contamination. The product may be transferred on rotating cylindrical fixtures through each processing station. The individual stations may run concurrently so that the process from beginning to completion is continuous and therefore efficient. Each individual station is separated by station interlocks. For example, a plurality of interior interlocks may be configured to open and close in a desired sequential pattern or at the same time such that a plurality of parts can be processed quickly, efficiently, and simultaneously in separate chambers and advance to a subsequent chamber substantially simultaneously. This would enhance the overall processing speed by eliminating the downtime. A partial vacuum is preferably maintained throughout the whole system to decrease pump down time in each station, further increasing throughput. Each chamber advantageously contains a separate vacuum pump for the required precise control of each portion of the process. The use of separate sealed chambers separated by interlocks and in which the individual chambers or stations that implement the separate process steps results in an efficient, step-wise process of advancing the components/parts through the system. Upon completion of the multiple station process, the parts on the cylindrical fixture are complete, or the parts may be transported to an organic top coat line to give the final part further protection and weatherability. The interlock system may rely on the opening and closing of gate valves between the chambers and the use of separated vacuum chambers may reduce or prevent residual gases from contaminating the system.

[0049] The apparatus may include a plurality of carts configured to carry the parts, a drive mechanism, sensors on the carts, and sensors on the gate valves between chambers to synchronize the process. The various vacuum chambers may be under different vacuums at similar vacuum levels. Each cart is dimensioned for receipt in the different chambers and suitable controls are provided for advancing the carts seriatim into the chambers in order to progressively apply the desired layers to the substrate.

[0050] It is also preferred that opening and closing of the outer chambers may be staggered relative to the interior chambers.

[0051] In the multi-chambered apparatus, the chambers and substrate fixture may be oriented vertically. The chambers may be made of any suitable material that is impervious to the processing parameters, and is steel (e.g., mild steel) in the preferred embodiment. Dynamic sputtering deposition steps may be used to apply various layers of different materials onto substrates mounted on fixtures (e.g., rotating fixtures).

[0052] FIG. 2 illustrates a coated part 201 in accordance with some embodiments of the present disclosure. The coated part 201 includes a substrate 210 made of a base material (e.g., plastic), a base coat 220, an adhesion layer 240, a first S1O2 layer 250, an appearance layer 260, and a second S1O2 layer 270. The second S1O2 layer 270 may define an outermost layer of the part 201. In some embodiments, the part 201 is useful for interior and/or low wear applications.

[0053] FIG. 3 illustrates a coated part 301 in accordance with other embodiments of the present disclosure. The coated part 301 includes a substrate 310 made of a base material (e.g., plastic), a base coat 320, an adhesion layer 340, a first S1O2 layer 350, an appearance layer 360, a second S1O2 layer 370, and a top coat 380 (e.g., an organic top coat). In some embodiments, the part 301 is useful for interior and/or low wear applications; however, the addition of the top coat 380 makes the final product particularly more adaptable to more stringent applications, e.g., exterior and/or high wear applications. In preferred embodiments, the top coat is hydrophobic.

[0054] Non-limiting examples of top coat materials include the materials disclosed above for the base coat.

[0055] The same or a different fixture may be used in each PVD chamber and/or PVD step. The fixture may be stationary or rotary (optionally with planetary motion). The fixture may ensure that at least one surface to be coated is exposed while shielding at least one surface that is not to be coated. The substrate may be cleaned prior to any or all PVD steps. Cleaning may remove contaminants that would potentially reduce adhesion between layers.

[0056] FIG. 4 is a schematic diagram of an apparatus, a machine, or a system in accordance with some embodiments of the present disclosure. Although the depicted machine includes 8 chambers, in other embodiments, machines of the present disclosure may contain from 2 to about 20 chambers, or even more than 20 chambers. Each chamber may be operatively associated with its own pump for generating/maintaining a vacuum during processing. In other embodiments, the same pump may be associated with at least two chambers depending on desired system processing speed, chamber volumes, type of processing occurring in at least two chambers that share a common pump, etc. In FIG. 4, the fixture travels from right to left as indicated by the arrow. The machine includes entrance chamber M1 , adhesion layer chamber M2, first S1O2 base layer chamber M3, second S1O2 base layer chamber M4, first reflective metal layer chamber M5, second reflective metal layer chamber M6, S1O2 top layer chamber M7, and exit chamber M8. Although some of these chambers are associated with specific deposition materials in FIG. 4, it should be understood that the machines of the present disclosure are not limited to depositing these specific materials. The machine may further include one or more fixtures (e.g., rotating fixtures) for mounting substrates (e.g., plastic substrates) to be coated.

[0057] Entrance chamber M1 may be configured to glow-discharge and/or plasma pre treat the substrate. Prior to entry into chamber M1 , the substrate may have been coated with a base coat as described above. The base coat may contain a silicone. The process gas may include air and/or argon. In some embodiments, a silicone (e.g., Glipoxan) may be applied via chemical vapor deposition. Glipoxan may be included in the process gas.

[0058] Separate chambers M3 and M4 may be used to deposit the same material or similar materials. The use of distinct chambers for this purpose may be advantageous where trying to achieve a desired thickness in a single chamber or step would be rate- limiting. For example, if the deposition of the adhesion layer in chamber M2 is expected to proceed twice as quickly as the deposition of the S1O2 base layer in a single chamber, then it may be beneficial to separate the S1O2 deposition into two separate chambers. Where multiple chambers are used to deposit the same or similar compositions, an interface may be detectable between the sublayers deposited in different chambers. Although the depicted embodiment includes two chambers for deposition of the S1O2 base layer, it is also possible to use more than two chambers (e.g., 3, 4, 5, 6, 7, 8, 9, 10). In some embodiments, the Si02 base layer has a total thickness of about 120 nm ± 20 nm, regardless of how many sublayers are applied in different chambers.

[0059] Similar to chambers M3 and M4, chambers M5 and M6 may also be used to deposit the same or similar compositions. It should also be recognized that this principle may also be applied to other chambers (e.g., M2, M7) where deposition of the same material is not split into multiple steps in different chambers. Layer depositions may be split into distinct steps/chambers depending on the desired product. In some embodiments, nitrogen is only included in the process gas in one of chambers M5 and M6. In some embodiments, the reflective/appearance layer has a total thickness of about 50 nm ± 10 nm, regardless of how many sublayers are applied in different chambers and the sublayers can be of generally equal thickness or have different thicknesses.

[0060] Exit chamber M8 may be configured for applying a top coat which may be a protective coating. Plasma enhanced chemical vapor deposition components may be included for this purpose. The top coat may contain a silicone (e.g., Glipoxan). Glipoxan may be included in the process gas.

[0061] Interlocks between chambers M2-M7 or M1-M8 may be configured to open and close simultaneously for continuous processing. This may allow each chamber to process a different part at the same time. It is possible that the interlocks for the entrance and exit chambers are not synchronized with the other interlocks. Chambers M2-M7 may be operated under similar vacuums.

[0062] Vacuum measuring equipment may be included for measuring pressures in one or more of the chambers as part of a control system.

[0063] The machine may be modular such that the number of chambers/modules can be changed by adding or subtracting chambers/modules (e.g., from a common frame). This may be particularly useful when the machine is used for different applications. Seals, such as O-rings, may contain fluorocarbon elastomers (e.g., VITON®) and provide an effective seal between the different chambers.

[0064] The multilayer coating may satisfy one or more of the following standards: • Abrasion Resistance: SAE J948, Taber method, 500 g load, CS-10 wheels, wherein the coating shall show no abrasion through to the substrate;

• Crocking: FLTM BN 107-01 , 10 cycles, AATCC Evaluation Procedure 2, with rating 4 min;

• Resistance to Scuffing: SAE J365, smooth plaque, 1000 cycles plus an additional 1000 cycles per 25 pm of coating with no wear through of the coating to the substrate;

• Scratch Resistance: FLTM BO 162-01 , visual inspection of surface, 1 mm scratch pins;

• Scratch Resistance for Scratch Resist Coatings: FLTM BN 107-01 , 150 cycles, dry with no visual scratch;

• Mar Resistance: FLTM Bl 161 -01 , 2 and 10 double strokes, 70% gloss retention and no visual mar at all angles; and

• Abrasion and Wear Resistance Using the Abrex Machine: FLTM BN 155-01 , AATCC Procedure 1 , load 5 N, 30,000 cycles, AATCC color change 4 min, no coating wear through.

[0065] It is possible to provide coatings with particular appearances by selecting particular materials and combinations thereof. The number of different potential appearances is nearly limitless. However, some non-limiting examples are summarized in the Table below. The various columns with headers starting with“M” refer to the chambers in FIG. 4. In some embodiments, the appearance is modified by adjusting the composition applied in one or more of chambers M3-M7.

[0066] In the laser etched coatings, the coating may be laser etched to remove previously applied layers in certain areas. An organic topcoat is then applied to protect the area that was etched.

[0067] The exemplary embodiment has been described with reference to the preferred embodiments. Obviously, modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended that the exemplary embodiment be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.