Title:
COIL MODULE, COIL ENCAPSULATION STRUCTURE, AND WIRELESS CHARGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/166221
Kind Code:
A1
Abstract:
A coil module, comprising a coil, a magnetic conductive plate, and an adapter plate. The magnetic conductive plate is provided on the coil; and the adapter plate is provided on the coil, is electrically connected to the coil, and is configured to be connected to the coil. By adding the adapter plate, the adapter plate is first connected to the coil, and transition connection is performed by means of the adapter plate, such that faults such as the detachment and poor contact of the coil are prevented, and a possibility is provided for the integrated encapsulation of the coil module. The present application further provides a coil encapsulation structure and a wireless charging device.
Inventors:
LIU XIAOGANG (CN)
GONG LEXING (CN)
JIANG FAN (CN)
WANG LE (CN)
YU ZHENQI (CN)
GONG LEXING (CN)
JIANG FAN (CN)
WANG LE (CN)
YU ZHENQI (CN)
Application Number:
PCT/CN2021/120745
Publication Date:
August 11, 2022
Filing Date:
September 26, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01F27/29; H01F27/28; H01F38/14; H02J50/00
Domestic Patent References:
| WO2016144119A1 | 2016-09-15 |
Foreign References:
| CN210575357U | 2020-05-19 | |||
| CN107134354A | 2017-09-05 | |||
| CN207459841U | 2018-06-05 | |||
| CN110931220A | 2020-03-27 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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