Title:
COLLOIDAL SILICA FOR METAL POLISHING
Document Type and Number:
WIPO Patent Application WO/2020/218089
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing colloidal silica for metal polishing, whereby a high polishing rate can be achieved. The aforementioned problem can be solved by this colloidal silica for metal polishing, containing silica particles in which a functional group including at least one carboxyl group is fixed to the surfaces thereof via a covalent bond.
More Like This:
| WO/2000/066491 | SILICA-BASED SOLS |
| JP5019076 | Method for manufacturing silica sol having an elongated shape |
| JP4979930 | Manufacturing method of anisotropic silica sol |
Inventors:
SUGIYAMA DAISUKE (JP)
NAKANO CHIHARU (JP)
NAKANO CHIHARU (JP)
Application Number:
PCT/JP2020/016437
Publication Date:
October 29, 2020
Filing Date:
April 14, 2020
Export Citation:
Assignee:
FUSO CHEMICAL CO LTD (JP)
International Classes:
C01B33/141; B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| WO2018168206A1 | 2018-09-20 |
Foreign References:
| JP2016069622A | 2016-05-09 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Download PDF: