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Patent Searching and Data


Title:
COMBINED MODULAR LATTICE-TYPE FLOOR PANEL
Document Type and Number:
WIPO Patent Application WO/2021/035539
Kind Code:
A1
Abstract:
A combined modular lattice-type floor panel is formed by combining multiple floor panel modules (1). Cross-connected lattice-type structures are symmetrically arranged at two outer sides of the floor panel module (1). The floor panel module (1) is provided therein with lateral communication channels and/or longitudinal communication channels for communication with other floor panel modules (1). The cross-connected lattice-type structures are connected to the communication channels. The communication channel is a through-channel. A fastening device (2) is provided inside and extends through the communication channel (1) to exert forces upon the floor panel modules. The floor panel module (1) is made of a light-weight material containing an organic substance, an inorganic substance and a polymer material. Methods, such as injection molding, die casting, mold casting, and 3D printing, can be used to form a floor panel module (1) having a lattice-type structure.

Inventors:
ZOU SHENGBIN (CN)
CHEN YIQING (CN)
Application Number:
PCT/CN2019/102868
Publication Date:
March 04, 2021
Filing Date:
August 27, 2019
Export Citation:
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Assignee:
ZOU SHENGBIN (CN)
CHEN YIQING (CN)
International Classes:
E04C1/00; E04B5/00
Domestic Patent References:
WO2019138221A12019-07-18
Foreign References:
CN108487538A2018-09-04
CN208858042U2019-05-14
CN208396128U2019-01-18
CN208533842U2019-02-22
CN105926824A2016-09-07
CN101809237A2010-08-18
FR2890090B12009-02-27
Attorney, Agent or Firm:
CHONGQING HANSUN INTELLECTUAL PROPERTY AGENT CO., LTD (CN)
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