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Title:
COMPONENT FEEDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/138480
Kind Code:
A1
Abstract:
This component feeding device is provided with a conveying surface on which a plurality of components are conveyed in a state of being aligned without space, a tapered surface for conveying obliquely upward at least a head component from among the plurality of components conveyed on the conveying surface, and a flat surface which is fixedly disposed to the tapered surface in a state of continuing from the tapered surface and extending in a horizontal direction and to which the components are conveyed from the tapered surface, wherein the components are fed on the flat surface.

More Like This:
JPS6112100METHOD OF SUPPLYING PART
JPH0837395DEVICE AND METHOD FOR SUPPLYING SEMICONDUCTOR CHIP
Inventors:
NARUMI KENTA (JP)
KUSAKARI ISAO (JP)
KAJIYAMA YUKI (JP)
Application Number:
PCT/JP2018/000404
Publication Date:
July 18, 2019
Filing Date:
January 11, 2018
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/02; B65G51/02
Foreign References:
JPH0964590A1997-03-07
JPH10313193A1998-11-24
JP2006173606A2006-06-29
JPH0629693A1994-02-04
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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