Title:
COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2021/199261
Kind Code:
A1
Abstract:
A component module provided with: a substrate 40; a metal layer 42 provided on the substrate; a coil component 10 which comprises a winding 12, a core material 14 covering at least a part of the winding, and terminals 13a, 13b electrically connecting the winding 12 to the metal layer 42, and which is mounted on the substrate 40; and a heat-dissipating member connected to the terminals 13a, 13b and/or the metal layer 42 via a route other than the core material 14.
Inventors:
KAWANO MICHIHARU (JP)
NATSUME MASASHI (JP)
NATSUME MASASHI (JP)
Application Number:
PCT/JP2020/014782
Publication Date:
October 07, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01F27/28; H01F27/22
Domestic Patent References:
| WO2017038369A1 | 2017-03-09 | |||
| WO2017126315A1 | 2017-07-27 | |||
| WO2017208745A1 | 2017-12-07 |
Foreign References:
| JPH04134815U | 1992-12-15 | |||
| JPH10106847A | 1998-04-24 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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