Title:
COMPONENT MOUNTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2021/053790
Kind Code:
A1
Abstract:
This component mounting machine comprises an image-capturing device being moved by a moving device for moving a head and capturing an image of a substrate. The component mounting machine performs a mounting operation in which a component held by a holding member is mounted on the substrate and then performs an inspection in which an image of the component mounted on the substrate is captured and the mounting state of the component is inspected on the basis of the captured image. If the mounting state is found to be abnormal in the inspection, the component found to be abnormal is removed from the substrate, and abnormality processing is performed to make an operator call for prompting checking of the state of the substrate.
More Like This:
Inventors:
KADOGAWA JOJI (JP)
NOZAWA TATSUJI (JP)
NOZAWA TATSUJI (JP)
Application Number:
PCT/JP2019/036759
Publication Date:
March 25, 2021
Filing Date:
September 19, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08
Domestic Patent References:
| WO2011043080A1 | 2011-04-14 |
Foreign References:
| JP2004039819A | 2004-02-05 | |||
| JP2005216958A | 2005-08-11 | |||
| JP2011018816A | 2011-01-27 | |||
| JP2004111424A | 2004-04-08 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Download PDF: