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Patent Searching and Data


Title:
COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/075051
Kind Code:
A1
Abstract:
This component mounting method, for mounting, onto a substrate, an electronic component constituted by a component body and an electrode that extends downward from the bottom surface of the component body, comprises: a forming step for forming a step section on an upper surface of the substrate; an application step for applying a conductive adhesive on an upper side surface and a lower side surface of the step section; and a placing step for placing the electronic component on the upper surface of the substrate so that the component body adheres to the conductive adhesive applied onto the upper side surface of the step section and so that the electrode adheres to the conductive adhesive applied onto the lower side surface of the step section.

Inventors:
TUKADA KENJI (JP)
TOMINAGA RYOJIRO (JP)
Application Number:
PCT/JP2019/041125
Publication Date:
April 22, 2021
Filing Date:
October 18, 2019
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K1/02; H05K1/18; H05K3/34
Foreign References:
JPH04134872U1992-12-15
JP2000200953A2000-07-18
JPH01253295A1989-10-09
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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