Title:
COMPONENT MOUNTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/234848
Kind Code:
A1
Abstract:
A component mounting system (100) is configured such that a pick-and-place machine (1) and an inspection device (5) are data-communicably connected with a management device (6). The pick-and-place machine (1) includes a mounting analysis unit (46) that acquires vacuum-pickup position offset data (D1) per component-loading operation by a loading head (251). The inspection device (5) includes an inspection analysis unit (533) that acquires loading position offset data (D31) corresponding to each of a plurality of target loading positions. The management device (6) includes a mark-generating unit (652) and a display unit (62). The mark-generating unit (652) generates vacuum-pickup shift marks (MA1) and loading offset marks (MA2) that visualize the direction and the magnitude of the position offsets, on the basis of vacuum-pickup position offset data (D1) and loading position offset data (D31). The display unit (62) displays the vacuum-pickup offset marks (MA1) or the loading offset marks (MA2) at respective marking positions (MP) on a baseplate graphic (GP).
Inventors:
IMADA HIKARU (JP)
Application Number:
PCT/JP2020/019909
Publication Date:
November 25, 2021
Filing Date:
May 20, 2020
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2018100717A1 | 2018-06-07 |
Foreign References:
| JP2011086695A | 2011-04-28 | |||
| JPS61293000A | 1986-12-23 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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