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Patent Searching and Data


Title:
COMPOSITE MATERIAL BONDING APPARATUS AND COMPOSITE MATERIAL BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/145012
Kind Code:
A1
Abstract:
Provided is a composite material bonding apparatus that can reduce a cycle time when composite material members are bonded to each other. The composite material bonding apparatus comprises a sheet-heater moving device that places a graphite heater (3) at an insertion position between a first bonded surface (W1c) of a first composite material member (W1) and a second bonded surface (W2c) of a second composite material member (W2) such that the graphite heater (3) is parallel to the first bonded surface (W1c) and the second bonded surface (W2c) facing the first bonded surface (W1c), and retracts the graphite heater (3) to a retraction position from the insertion position. The first bonded surface (W1c) and the second bonded surface (W2c) are heated at the insertion position by the graphite heater (3), and then the graphite heater (3) is moved to the retraction position by the sheet-heater moving device.

Inventors:
MORIYA MAKOTO (JP)
ISHIDA MAKOTO (JP)
OTOBE SHOGO (JP)
TERASAKA AKIHIRO (JP)
Application Number:
PCT/JP2020/049237
Publication Date:
July 07, 2022
Filing Date:
December 28, 2020
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C65/02
Foreign References:
JP2017205960A2017-11-24
CN106785232A2017-05-31
JP2007245458A2007-09-27
Attorney, Agent or Firm:
FUJITA, Takaharu (JP)
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