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Title:
COMPOSITE MATERIAL, METHOD OF MANUFACTURING SAME, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/130008
Kind Code:
A1
Abstract:
Provided is a method of manufacturing a composite material, the method comprising a step for heating a prepreg containing glass cloth and a thermosetting resin composition to 200°C or higher, wherein an average filament diameter ratio (warp /weft) of warp and weft constituting the glass cloth is more than 1.00, and a weave density ratio (warp /weft) of warp and weft is more than 1.00. Also provided are a composite material obtained by the manufacturing method, a laminated board using the composite material and a method of manufacturing the laminated board, a printed wiring board and a semiconductor package, and a prepreg for use in a method for manufacturing the composite material.

Inventors:
SHIRAOKAWA YOSHIKATSU (JP)
KANEKO TATSUNORI (JP)
GOZU SHUJI (JP)
KAKITANI MINORU (JP)
Application Number:
PCT/JP2019/049510
Publication Date:
June 25, 2020
Filing Date:
December 18, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
D03D1/00; C08J5/24; H05K1/03; C08K5/3415; C08L63/00
Domestic Patent References:
WO2018181286A12018-10-04
Foreign References:
JP2018127750A2018-08-16
JP2016222837A2016-12-28
JPH055243A1993-01-14
JPH09111577A1997-04-28
JPH07252747A1995-10-03
JPH10245743A1998-09-14
JPS63267514A1988-11-04
JP2019104996A2019-06-27
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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