Title:
COMPOSITE PLATED MATERIAL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/019907
Kind Code:
A1
Abstract:
Provided are: a composite plated material in which a composite plating film that comprises a composite material comprising a silver layer and carbon particles contained in the silver layer is formed on a base material, and in which the falling off of the carbon particles in the composite plating film is reduced; and a method for producing the composite plated material. Electroplating is carried out using a silver plating solution containing carbon particles to form a composite plating film that comprises a composite material comprising a silver layer and carbon particles contained in the silver layer on a base material (preferably made from copper or a copper alloy), and then a treatment for removing a portion of the carbon particles on the surface is carried out.
Inventors:
KOTANI HIROTAKA (JP)
KATO YUKIYA (JP)
DOI TATSUHIRO (JP)
TOMIYA TAKAO (JP)
NARIEDA HIROTO (JP)
KATO YUKIYA (JP)
DOI TATSUHIRO (JP)
TOMIYA TAKAO (JP)
NARIEDA HIROTO (JP)
Application Number:
PCT/JP2020/022071
Publication Date:
February 04, 2021
Filing Date:
June 04, 2020
Export Citation:
Assignee:
DOWA METALTECH CO LTD (JP)
International Classes:
C25D15/02; C25D5/12; C25D7/00; H01H1/04; H01H11/04; H01R13/03
Domestic Patent References:
| WO2015083547A1 | 2015-06-11 |
Foreign References:
| JP2007254876A | 2007-10-04 | |||
| JP2017052978A | 2017-03-16 | |||
| JP2009249648A | 2009-10-29 | |||
| JP2018199839A | 2018-12-20 | |||
| JP2000128640A | 2000-05-09 | |||
| JP2013091289A | 2013-05-16 | |||
| JP2016219524A | 2016-12-22 |
Attorney, Agent or Firm:
OKAWA Koichi (JP)
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