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Patent Searching and Data


Title:
COMPOSITION FOR BONDING CURABLE IMPRINTING COMPOSITION AND SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/191118
Kind Code:
A1
Abstract:
The present invention provides a composition for bonding a curable imprinting composition and a substrate, the bonding composition minimizing pattern defects while exhibiting exceptional substrate-bonding performance. A composition for bonding a curable imprinting composition and a substrate, the bonding composition having a reactive-group-containing compound having a molecular weight of at least 500, and containing no more than 10 percent by mass of a compound having a molecular weight of no more than 200.

Inventors:
HATTORI AKIKO (JP)
KITAGAWA HIROTAKA (JP)
ENOMOTO YUICHIRO (JP)
Application Number:
JP2013/066547
Publication Date:
December 27, 2013
Filing Date:
June 17, 2013
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/027; B29C59/02; C08F299/02; C08G12/32
Domestic Patent References:
WO2011021573A12011-02-24
Foreign References:
JP2011508680A2011-03-17
JP2011168003A2011-09-01
JP2011114180A2011-06-09
JP2010045163A2010-02-25
JP2012078602A2012-04-19
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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